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Ethylene-Vinyl Acetate Copolymers - EVA
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EVATHENE® EVA resins are ethylene-vinyl acetate copolymers made by high pressure autoclave process. They are mainly used for foaming, coating, extrusion, and injection molding applications for many important industrial market segments such as shoe soles, sheets, wire and cable, hot melt adhesive, and solar cell encapsulation. EVATHENE® EVA resins can also be blended with other resins for various applications.
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Main applications：
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Wire & Cable、Hot melt adhesion、Shoe sole foaming、Powder Hot Melt (for hot melt adhesion of non-woven -fabric)、Hot melt、Injection foam、Sheet extrusion、Blow molding、Compression molding（Foam）、Film extrusion (with additive)、Injection molding、General Compounding、Wire & Cable Compounds、Compressing molding（Foam）。
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Basket - Blown film extrusion
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Encapsulant film - Extrusion molding
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| Packing： |
PE Bag
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Weight：25 kgs net
Length x Width x Height：65(±2) x 42(±1) x 13(±3) cm
Dimensions of packing are subjected to different types.
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| Item |
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| MSDS - Material Safety Data Sheet |
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| # | Products | Main Applications | VA
％ | MI
g/10min | File |
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1
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UE508
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 Powder Hot Melt (for hot melt adhesion of non-woven -fabric)
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8
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85.00
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2
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UE612-04
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 Hot melt
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19
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150.00
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3
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UE629
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Injection foam
Shoe sole foaming
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18
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2.50
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4
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UE630
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Sheet extrusion
Blow molding
Compression molding（Foam）
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16
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1.50
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5
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UE632
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Injection foam
Shoe sole foaming
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22
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2.20
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6
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UE633
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Injection molding
Hot melt
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19
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20.00
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7
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UE634-04
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Wire & Cable
Hot melt
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28
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6.00
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8
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UE638-04
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Injection molding
Hot melt
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28
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18.00
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9
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UE639-04
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Hot melt
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28
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150.00
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10
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UE649-04
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Hot melt
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19
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400.00
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11
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UE653-04
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Hot melt
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28
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400.00
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12
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UE654-04
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General Compounding
Wire & Cable Compounds
Hot melt
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33
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30.00
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The information contained herein is, to our best knowledge, true and accurate. However, since conditions of use are beyond our control, all recommendations or suggests are presented without guarantee or responsibility on our part. We disclaim all liability in connection with the use of information contained herein or otherwise. All risks of such use are assumed by the user. Furthermore, nothing contained herein shall be constructed as an inducement or recommendation to use any process or to manufacture or use any product in conflict with existing or future patents.
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